Job responsibilities:

Be responsible for the failure analysis and detection of surface treatment electroplated film thickness.

Job requirements:

1. College degree or above, major in electronic technology, microelectronics, physics, materials, etc;

2. More than 3-5 years of experience in failure analysis of electronic products, and master relevant technology of failure analysis;

3. Familiar with coating thickness and micropore number test, as well as the performance of related equipment;

4. Work earnestly and responsibly, have strong communication and learning abilities, and strong hands-on and analytical abilities.

Monthly salary 6-12K